摘要：本發明提供了一種電力轉換電路的封裝模塊，本發明利用支撐構件與支撐螺栓的相互配合達到防止DBC陶瓷基板和散熱基板的翹曲；在所述DBC陶瓷基板的周緣部不設置導電圖案，使得周緣部較薄，可以進一步抑制應力；支撐構件及其支撐螺栓搭建起散熱路徑，進步增強散熱效果；在使用第一焊料焊接所述DBC陶瓷基板和散熱基板時，環形凹槽可以防止第一焊料在散熱基板的上表面的橫向擴散，防止焊料堵塞第一貫通孔，以及防止殼體與所述散熱基板的接合。

Abstract： The invention provides a package module of a power conversion circuit so as to achieve a purpose of preventing warping of a DBC ceramic substrate and a radiating substrate through mutual cooperation between a support member and a support bolt. The peripheral portion of the DBC ceramic substrate is not provided with a conductive pattern, so that the peripheral portion is allowed to be thin, which can further suppress stress; the support member and the support bolt construct a heat dissipation path, thereby further enhancing a heat radiation effect; and when the DBC ceramic substrate and the radiating substrate are welded through a first solder, an annular groove can prevent the first solder from diffusing transversely on the upper surface of the radiating substrate, thereby preventing the solder from blocking a first through hole and preventing joint between the housing and the radiating substrate.